(Bloomberg) — Sony Corp., the biggest maker of camera chips used in smartphones, is boosting production of next-generation 3D sensors after getting interest from customers including Apple Inc.
The chips will power front- and rear-facing 3D cameras of models from several smartphone makers in 2019, with Sony kicking off mass production in late summer to meet demand, according to Satoshi Yoshihara, head of Sony’s sensor division. He declined to provide sales or production targets, but said the 3D business is already operating profitably and will make an impact on earnings from the fiscal year starting in April.
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